\n\u56fe10\u5728\u6d82\u8986\u67091\u5fae\u7c73SiN(\u6c2e\u5316\u7845)\u963b\u6321\u5c42\u7684SGW8\u57fa\u677f\u4e0a\uff0c\u7ecf\u8fc7\u504f\u7f6eHAST\u5904\u7406\u540e\u7684\u94dc\u4ea4\u53c9\u6307\u72b6\u6d4b\u8bd5\u7ed3\u6784(Cu IDT)\u7684\u626b\u63cf\u7535\u5b50\u663e\u5fae\u955c(SEM)\u56fe\u50cf<\/p>\n
\u80fd\u8c31\u5206\u6790\u663e\u793a\uff0c\u5728\u624b\u6307\u95f4\u7684BCB(\u82ef\u5e76\u73af\u4e01\u70ef)\/\u73bb\u7483\u754c\u9762\u672a\u68c0\u6d4b\u5230\u94dc(Cu)\u7684\u5b58\u5728<\/p>\n<\/section>\n<\/section>\n\n\n#3<\/strong><\/span><\/p>\n<\/section>\n<\/section>\n\n\n\u7ed3\u8bba<\/strong><\/p>\n<\/section>\n<\/section>\n\nConclusion<\/p>\n<\/section>\n<\/section>\n<\/section>\n<\/section>\n\n\n\u504f\u7f6eHAST\u548c\u70ed\u5faa\u73af\u6d4b\u8bd5\u88ab\u7528\u6765\u8bc4\u4f30\u5de5\u7a0b\u73bb\u7483\u5728\u4e2d\u95f4\u5c42\u5e94\u7528\u4e2d\u7684\u53ef\u9760\u6027\u4e24\u4e2a\u5173\u952e\u65b9\u9762\u3002\u9996\u5148\uff0c\u901a\u8fc7\u5728-40\u00b0C\u81f3125\u00b0C\u76841000\u6b21\u70ed\u5faa\u73af\uff0c\u9a8c\u8bc1\u4e86SGW3\u548cSGW8\u57fa\u677f\u4e0a\u94dc\u586b\u5145\u7684TGVs\u7684\u53ef\u9760\u6027\u3002\u4f7f\u752820\u00d720\u6392\u5217\u768435 \u03bcm\u00d7120 \u03bcm TGV\u9635\u5217\uff0c\u4ee5\u83ca\u82b1\u94fe\u7684\u5f62\u5f0f\uff0c\u6d4b\u8bd5\u4e86\u70ed\u5faa\u73af\u524d\u540e\u7684\u7535\u8fde\u7eed\u6027\u548c\u7535\u963b\u3002\u70ed\u5faa\u73af\u540e\uff0c\u5728\u4e24\u79cd\u57fa\u677f\u4e0a\u6d4b\u8bd5\u7684\u6240\u6709TGV\u9635\u5217\u5747\u663e\u793a\u8fde\u7eed\u6027\uff0c\u6ca1\u6709\u89c2\u5bdf\u5230TGV\u6216\u5e03\u7ebf\u91d1\u5c5e\u7684\u5931\u6548\u3002\u5bf9\u4e24\u79cd\u7c7b\u578b\u57fa\u677f\u4e0a\u5236\u5907\u7684TGV\u9635\u5217\u8fdb\u884c\u4e86\u622a\u9762\u6837\u54c1\u5236\u5907\uff0c\u5e76\u8fdb\u884c\u4e86\u626b\u63cf\u7535\u5b50\u663e\u5fae\u955c\u6210\u50cf\u3002\u5c3d\u7ba1\u94dc\u548c\u73bb\u7483\u57fa\u677f\u4e4b\u95f4\u7684\u70ed\u81a8\u80c0\u7cfb\u6570\uff08CTE\uff09\u4e0d\u5339\u914d\uff0c\u4f46\u5728TGV\u9644\u8fd1\u6ca1\u6709\u89c2\u5bdf\u5230\u73bb\u7483\u5f00\u88c2\u6216\u5e03\u7ebf\u91d1\u5c5e\u62ac\u8d77\u7684\u73b0\u8c61\u3002<\/p>\n<\/section>\n<\/section>\n
<\/p>\n\n\n\u5728\u53ef\u9760\u6027\u6d4b\u8bd5\u7684\u7b2c\u4e8c\u90e8\u5206\uff0c\u91c7\u7528\u504f\u7f6eHAST\u65b9\u6cd5\u7814\u7a76\u4e86\u94dc\u5e03\u7ebf\u91d1\u5c5e\u4e0e\u4e0d\u540c\u7c7b\u578b\u73bb\u7483\u57fa\u677f\u7684\u517c\u5bb9\u6027\u3002\u5728SGW3\u3001SGW8\u3001\u5e26\u67091 \u03bcm Si3N4\u963b\u6321\u5c42\u7684SGW8\u3001\u7194\u878d\u4e8c\u6c27\u5316\u7845\u4ee5\u53ca\u5e26\u67093k\u00c5\u70ed\u6c27\u5316\u7269\u7684\u7845\u6676\u7247\u4e0a\uff0c\u5236\u5907\u4e86\u7ebf\u8ddd\u4e3a10 \u03bcm\u7684Cu IDTs\u3002\u5728\u7ecf\u8fc796\u5c0f\u65f6\u504f\u7f6eHAST\u6d4b\u8bd5\u4e4b\u524d\u548c\u4e4b\u540e\u5bf9IDTs\u8fdb\u884c\u7684\u6f0f\u7535\u6d41\u6d4b\u91cf\u663e\u793a\uff0c\u53ea\u6709\u672a\u6d82\u8986\u963b\u6321\u5c42\u7684SGW8\u57fa\u677f\u4e0a\u7684\u7535\u963b\u51fa\u73b0\u4e86\u5927\u5e45\u4e0b\u964d\u3002\u5728\u5176\u4ed6\u57fa\u677f\u4e0a\uff0c\u5305\u62ecSGW3\u73bb\u7483\uff0c\u5728HAST\u4e4b\u540e\u6ca1\u6709\u89c2\u5bdf\u5230\u6cc4\u6f0f\u7535\u6d41\u7684\u663e\u8457\u53d8\u5316\u3002\u901a\u8fc7\u5149\u5b66\u68c0\u6d4b\u7ed3\u5408SEM\/EDS\u5206\u6790\uff0c\u786e\u5b9a\u4e86\u94dc\u6cbf\u7740SGW8\u73bb\u7483\u57fa\u677f\u9876\u8868\u9762\u7684\u8fc1\u79fb\u662f\u5bfc\u81f4\u6cc4\u6f0f\u8def\u5f84\u7684\u539f\u56e0\u3002\u6c2e\u5316\u7845\u5c42\u63d0\u4f9b\u4e86\u6709\u6548\u7684\u5c4f\u969c\uff0c\u9632\u6b62\u4e86\u5bfc\u81f4Cu\u8fc1\u79fb\u7684\u673a\u5236\u3002\u56e0\u6b64\uff0c\u5728\u94dc\u91d1\u5c5e\u5316\uff08\u65e0\u8bba\u662f\u8868\u9762\u5e03\u7ebf\u91d1\u5c5e\u8fd8\u662fTGV\uff09\u548c\u7528\u4e8e\u9ad8CTE\u7684\u73bb\u7483\u57fa\u677f\u4e4b\u95f4\u5e94\u8be5\u4f7f\u7528\u963b\u6321\u5c42\u3002<\/span><\/p>\n<\/section>\n<\/section>\n <\/p>\n\n\nReferences\u00a0<\/span><\/p>\n1. V. Sukumaran et al., \u201cThrough-Package-Via Formation\u00a0and Metallization of Glass Interposers\u201d, Electronic\u00a0Components and Technology Conference (ECTC), IEEE\u00a060th (2010).\u00a0<\/span><\/p>\n2. I. Ndip et al., \u201cCharacterization of Interconnects and RF\u00a0Components on Glass Interposers\u201d, IMAPs 45th\u00a0International Symposium on Microelectronics, (2012).\u00a0<\/span><\/p>\n3. C. H. Chien et al., \u201cPerformance and Process Comparison\u00a0between Glass and Si Interposer for 3D-IC Integration\u201d,\u00a0IMAPs 46th International Symposium on Microelectronics,\u00a0(2013).\u00a0<\/span><\/p>\n4. X. Qin, N. Kumbhat, V. Sundaram, R. Tummala, \u201cHighly-\u00a0Reliable Silicon and Glass Interposers-to-Printed Wiring\u00a0Board SMT Interonnections: Modeling, Design,\u00a0Fabrication and Reliability\u201d, Electronic Components and\u00a0Technology Conference (ECTC), IEEE 62nd (2012).\u00a0<\/span><\/p>\n5. Shorey, A., Cochet, P., Huffman, A., Keech, J., Lueck, M.,\u00a0Pollard, S., & Ruhmer, K. \u201cAdvancements in fabrication\u00a0of glass interposers,\u201d in Proc. IEEE Electronic\u00a0Components and Technology Conf. (ECTC), 2014, pp. 20-\u00a025\u00a0<\/span><\/p>\n6. A. Shorey, S. Pollard, A. Streltsov, G. Piech, & R.\u00a0Wagner, \u201cDevelopment of substrates for through glass vias\u00a0(TGV) for 3DS-IC integration,\u201d in Proc. IEEE Electronic\u00a0Components and Technology Conf. (ECTC), 2012, IEEE\u00a0(pp. 289-291).\u00a0<\/span><\/p>\n7. Chien, Chun-Hsien, et al. \"Process, assembly and\u00a0electromigration characteristics of glass interposer for 3D\u00a0integration,\" in Proc. IEEE Electronic Components and\u00a0Technology Conf. (ECTC), 2014, IEEE 64th. IEEE, 2014.\u00a0<\/span><\/p>\n8. Yang, Ya-Tang, et al. \"Amorphous-silicon thin-film\u00a0transistor on soda-lime glass.\" Journal of the Society for\u00a0Information Display 17.4 (2009): 317-321.\u00a0<\/span><\/p>\n9. K. Demir, K. Ramachandran, Y. Sato, Q. Chen, V.\u00a0Sukumaran, R. Pucha, R. Tummala, \u201cThermomechanical\u00a0and electrochemical reliability of fine-pitch throughpackage-\u00a0copper vias (TPV) in thin glass interposers and\u00a0packages,\u201d in Proc. IEEE Electronic Components and\u00a0Technology Conf. (ECTC), 2013, IEEE (pp. 353-359).\u00a0<\/span><\/p>\n10.K. Demir, A. Armutlulu, J. Tong, R. Pucha, V. Sundaram,\u00a0R. Tummala, \u201cFirst demonstration of reliable copperplated\u00a030\udbc0\ude1dm diameter through-package-vias in ultra-thin\u00a0bare glass interposers,\u201d in Proc. IEEE Electronic\u00a0Components and Technology Conf. (ECTC), 2014, IEEE\u00a064th (pp. 1098-1102).\u00a0<\/span><\/p>\n<\/section>\n<\/section>\n<\/section>\n<\/section>\n<\/section>\n<\/section>\n<\/section>\n<\/section>\n\u6ce8\uff1a\u6587\u7ae0\u6765\u6e90\u4e8eCEIA\u7535\u5b50\u667a\u9020<\/em>\uff0c\u6587\u7ae0\u4ec5\u4f9b\u53c2\u8003\uff0c\u5982\u6d89\u53ca\u5230\u4fb5\u6743\u7b49\u95ee\u9898\uff0c\u8bf7\u8054\u7cfb\u5c0f\u7f16\u5220\u9664<\/em><\/em><\/p>\n\n<\/section>\n<\/section>\n\u827e\u90a6\u5efa\u6709\u73bb\u7483\u57fa\u677f\u4e0eTGV\u6280\u672f\u4ea4\u6d41\u7fa4\uff0c<\/strong>\u53ef\u4ee5\u52a0\u5f3a\u4ea7\u4e1a\u94fe\u7684\u5408\u4f5c\uff0c\u4fc3\u6210\u5404\u4f01\u4e1a\u7684\u9700\u6c42\u5bf9\u63a5\uff0c\u540c\u65f6<\/span>\u60a8\u4e5f\u53ef\u4ee5\u4e0e\u884c\u4e1a\u7cbe\u82f1\u5171\u540c\u63a2\u8ba8\u73bb\u7483\u57fa\u677f\u53caTGV\u6280\u672f\u7684\u524d\u6cbf\u52a8\u6001\uff0c\u5171\u4eab\u8d44\u6e90\uff0c\u4ea4\u6d41\u7ecf\u9a8c\uff0c\u6b22\u8fce\u60a8\u7684\u52a0\u5165\u3002<\/p>\n<\/section>\n