{"id":21736,"date":"2022-12-30T15:45:00","date_gmt":"2022-12-30T07:45:00","guid":{"rendered":"https:\/\/www.ab-sm.com\/?p=21736"},"modified":"2022-12-30T15:54:19","modified_gmt":"2022-12-30T07:54:19","slug":"2-5d%e5%85%88%e8%bf%9b%e5%b0%81%e8%a3%85%e4%bb%8b%e7%bb%8d%ef%bc%88%e8%a7%86%e9%a2%91%ef%bc%89","status":"publish","type":"post","link":"https:\/\/www.ab-sm.com\/a\/21736","title":{"rendered":"2.5D\u5148\u8fdb\u5c01\u88c5\u4ecb\u7ecd\uff08\u89c6\u9891\uff09"},"content":{"rendered":"<p><span style=\"color: #1a1a1a; font-size: 16pt;\"><strong>2.5D\u5148\u8fdb\u5c01\u88c5\u4ecb\u7ecd\uff08\u89c6\u9891\uff09<br \/>\n<\/strong><\/span><\/p>\n<p><img decoding=\"async\" src=\"https:\/\/file.ab-sm.com\/103\/uploads\/2022\/12\/0c789252e69dd67f8b7dc3b54c541fc1.jpg!a\" alt=\"\" \/><\/p>\n<p>Hello everyone, welcome to Samsung. Today I'd like to talk about 2.5 d package technology, which is one of the hottest topics in package technology. First of all, what is 2.5 deep package technology?<\/p>\n<p>\u5927\u5bb6\u597d\uff0c\u6b22\u8fce\u6765\u5230\u6211\u7684\u8282\u76ee\u3002\u4eca\u5929\u6211\u4eec\u8c08\u8c082.5D\u5c01\u88c5\u6280\u672f\uff0c\u8fd9\u662f\u5c01\u88c5\u6280\u672f\u4e2d\u6700\u70ed\u95e8\u7684\u8bdd\u9898\u4e4b\u4e00\u3002\u9996\u5148\uff0c\u4ec0\u4e48\u662f2.5D\u5c01\u88c5\u6280\u672f\uff1f<\/p>\n<p style=\"text-align: center;\"><img decoding=\"async\" src=\"https:\/\/file.ab-sm.com\/103\/uploads\/2022\/12\/a3faaf87da97cdc8c671c6b7d447f859.png!a\" alt=\"\" \/><span style=\"color: red;\"><br \/>\n<\/span><\/p>\n<p style=\"text-align: center;\"><span style=\"color: red;\">\u626b\u63cf\u4e8c\u7ef4\u7801\uff0c\u89c2\u770b\u89c6\u9891<br \/>\n<\/span><\/p>\n<p><img decoding=\"async\" src=\"https:\/\/file.ab-sm.com\/103\/uploads\/2022\/12\/28f0cb6bfa574497adea3901abe11f19.png!a\" alt=\"\" \/><\/p>\n<p><img decoding=\"async\" src=\"https:\/\/file.ab-sm.com\/103\/uploads\/2022\/12\/123e8fe33fa468748e27b6fa0dc1ae0b.png!a\" alt=\"\" \/><\/p>\n<p>2.5 d looks like this. It is the packaging technology using silicone interpreter to connect dies on it. And silicon interposa has tsb through silicon via fabrical electrical interconnection. Then this silicon interpreter with dice are placed on package substrate to make package. Those dies can be multiple logic dies or logic die plus memory die. Prologic dies it can be f p g. Dies, g p u. Dies or network dies. This is the simplified structural 2.5 d to explain function of.<\/p>\n<p>2.5D\u5c01\u88c5\u770b\u8d77\u6765\u50cf\u8fd9\u6837\u3002\u5b83\u662f\u4f7f\u7528\u5177\u6709\u7845\u901a\u5b54\u6280\u672f\u7684interposer\u5c06\u4e0d\u540c\u7684\u82af\u7c92\u8fdb\u884c\u8fde\u63a5\u7684\u6280\u672f\u3002Interposer \u5d4c\u5165\u5728\u57fa\u677f\u4e2d\uff0c\u6216\u8005\u4e0b\u9762\u4e0e\u57fa\u677f\u76f8\u8fde\uff0c\u4e0a\u9762\u9732\u51fa\u8fde\u63a5\u70b9\uff0c\u8fd9\u6837\u5c31\u53ef\u4ee5\u5c06\u591a\u4e2a\u82af\u7c92\u653e\u7f6e\u5728\u8fde\u63a5\u70b9\u4e0a \u3002\u8fd9\u4e9b\u82af\u7c92\u7684\u7c7b\u578b\u53ef\u4ee5\u662f\u903b\u8f91\u82af\u7247\uff0c\u9ad8\u5bbd\u5e26\u5b58\u50a8\u7684HBM\uff0cGPU\u7b49\u3002 \u8fd9\u662f\u4e2a\u7b80\u5316\u7248\u7684\u793a\u610f\u56fe\uff0c\u53ef\u4ee5\u770b\u5230\u6700\u4e0b\u5c42\u662f\u57fa\u677f\uff0c\u7136\u540e\u4e2d\u95f4\u5c42\u662f\u5177\u6709\u7845\u901a\u5b54\u6280\u672f\u7684interposer\uff0c\u6700\u4e0a\u5c42\u662f\u903b\u8f91\u82af\u7c92\u548c\u5b58\u50a8\u82af\u7c92\u3002<\/p>\n<p><img decoding=\"async\" src=\"https:\/\/file.ab-sm.com\/103\/uploads\/2022\/12\/c7760026e456ee58578a4e1994b3c48b.png!a\" alt=\"\" \/><\/p>\n<p>Type of silicone interpreter to connect logic die and memory die. For this case tap side of silicone temperature is also called as front side. More in detail, silicone interpreter has 3 part vertically. At top there is b e o l, back end of line layer which uses copper for electrical interconnection. If lining space of this carpet trace is fine less than 1\u03bcm it uses pol layer pie process but it can also use ideal for course copper trace at the middle there is tsp through silicon beer robotical electrical interconnection as its name implies tsp is a beer go through silicone supporter robotical electrical interconnection at the bottom there is r d l because it usually calls cafa trace bottom side of silicone interposter is also called as backside.<\/p>\n<p>\u518d\u770b\u770b\u66f4\u8be6\u7ec6\u7684\u793a\u610f\u56fe\uff0cInterposer \u5927\u81f4\u5206\u4e3a\u4e09\u5c42\uff0c\u6700\u4e0a\u9762\u7684\u4e00\u5c42\u662fBEOL\u5c42\uff0c\u4e2d\u95f4\u662fTSV \u7845\u901a\u5b54\u5c42\uff0c\u6700\u4e0b\u9762\u662fBSRDL\u5c42\u3002BEOL\u5c42\u4e5f\u53ebback end of line layer, \u5229\u7528\u94dc\u5c42\u8fdb\u884c\u8fde\u63a5\u3002TSV \u7845\u901a\u5b54\u5c42\u7528\u4e8e\u8fde\u63a5\u4e0a\u4e0b\u4e24\u5c42\u3002BSRDL \u5c42\u4e5f\u53ebback side \u91cd\u5e03\u7ebf\u5c42\u3002Interposer\u8d77\u5230\u7c7b\u4f3c\u6865\u6881\u7684\u4f5c\u7528\u5c06\u57fa\u677f\u4e0e\u82af\u7c92\u8fde\u63a5\u8d77\u6765\u3002<\/p>\n<p><img decoding=\"async\" src=\"https:\/\/file.ab-sm.com\/103\/uploads\/2022\/12\/19cd507da19022d3ab13d42f9a43cd86.png!a\" alt=\"\" \/><\/p>\n<p>Let's compare 2 d and 3 d to understand what is 2.5 d to the package. Is conventional package structure with dye with wire wounding or primitive. It also can be more than 2 dice side by side or stack dice, but they are not connected each other directly. How about 3 d? As you can see in the picture, chip a is connected with chip b with micro bump and chip b is connected with packet substrate at the bottom. Through tsb. We call this structure as ready.<\/p>\n<p>\u8ba9\u6211\u4eec\u5bf9\u6bd4\u4e00\u4e0b2 D\u548c3D\u5c01\u88c5\u7684\u533a\u522b\uff0c\u8fd9\u6837\u53ef\u4ee5\u66f4\u597d\u7684\u4e86\u89e3\u4ec0\u4e48\u662f2.5D\u30022D \u662f\u4f20\u7edf\u7684\u5c01\u88c5\u5f62\u5f0f\uff0c\u82af\u7c92\u901a\u8fc7wire bounding \u7684\u7ebf\u8fde\u63a5\u4e0e\u57fa\u677f\u76f8\u8fde\uff0c\u6216\u8005\u901a\u8fc7\u57fa\u677f\u4e0a\u7684C4\u4e0e\u82af\u7c92\u4e0a\u7684BUMP\u8fdb\u884c\u8fde\u63a5\u30022D\u4e5f\u53ef\u4ee5\u540c\u65f6\u653e\u7f6e\u591a\u4e2a\u82af\u7c92\uff0c\u4f46\u8fd9\u4e9b\u82af\u7247\u4e92\u76f8\u4e0d\u4f1a\u5806\u53e0\u5728\u4e00\u8d77\uff0c\u4e92\u76f8\u901a\u4fe1\u901a\u8fc7\u57fa\u677f\u76f8\u8fde\u3002\u800c3D\u662f\u4ec0\u4e48\u6837\u7684\u5462\uff1f\u5982\u56fe\u6240\u793a\uff0c\u82af\u7c92A\u4e0e\u82af\u7c92B\u901a\u8fc7\u5fae\u51f8\u70b9\u8fde\u63a5\uff0c\u82af\u7c92B \u901a\u8fc7TSV\u4e0e\u5e95\u90e8\u7684\u57fa\u677f\u8fde\u63a5\u3002<\/p>\n<p><img decoding=\"async\" src=\"https:\/\/file.ab-sm.com\/103\/uploads\/2022\/12\/1833b8d4f78ff2bdee3712e765c63f1d.png!a\" alt=\"\" \/><\/p>\n<p>What is the difference between 2.5 d and 3 d? Dies in 2.5 z package are electrically connected through silicone interposa, but Dyson 3 d is electrically connected directly. 2.5 d has tsb in silicone interposa, but 3 d has tsb in dice or one of dice cheaply for this case. This is an example of 2.5 d for fpgas.<\/p>\n<p>2.5D\u548c3D\u8fdb\u4e00\u6b65\u8fd8\u6709\u4ec0\u4e48\u5177\u4f53\u7684\u533a\u522b\u5462\uff1f\u5982\u793a\u610f\u56fe\u6240\u793a\uff0c2.5D\u5c01\u88c5\u7684\u82af\u7247\u901a\u8fc7interposer\u5c06\u4e24\u4e2a\u82af\u7c92\u8fdb\u884c\u8fde\u63a5\u3002\u800c3D\u5c01\u88c5\u5219\u662f\u4e24\u4e2a\u82af\u7c92\u5806\u53e0\u5e76\u76f4\u63a5\u76f8\u8fde\uff0c\u5176\u4e2d\u4e00\u4e2a\u82af\u7c92\u76f4\u63a5\u4e0e\u57fa\u677f\u8fde\u63a5\u3002 3D\u5c01\u88c5\u4e2d\u7684\u4e00\u4e2a\u82af\u7c92\u5177\u6709TSV \u7845\u901a\u5b54\u7ed3\u6784\u3002<\/p>\n<p><img decoding=\"async\" src=\"https:\/\/file.ab-sm.com\/103\/uploads\/2022\/12\/b21472a0febe942a8b1be0987131d651.png!a\" alt=\"\" \/><\/p>\n<p>Jailing's apj company breaks one big apga die into 4 pieces, then put on silicone interpreter to connect each other. Because if you make vapors with big fpz dyes, die yield will be low, but if he split into smaller dyes die yield will be better.<\/p>\n<p>\u8fd9\u662f\u4e00\u4e2a2.5D FPBGA\u7684\u82af\u7247\uff0c\u6574\u4e2a\u82af\u7247\u75314\u4e2a\u82af\u7c92\u7ec4\u5408\u800c\u6210\uff0c\u4e2d\u95f4\u4e3ainterposer\u5c42\u5c06\u82af\u7c92\u4e0e\u57fa\u677f\u8fde\u63a5\u3002\u4e3a\u4ec0\u4e48\u8981\u4e0d\u76f4\u63a5\u7ec4\u6210\u4e00\u4e2a\u82af\u7c92\u5462\uff1f\u8fd9\u4e3b\u8981\u662f\u6210\u672c\u7684\u8003\u8651\u3002\u5c0f\u7684\u82af\u7c92\u826f\u7387\u66f4\u9ad8\uff0c\u6210\u672c\u66f4\u4f4e\u3002<\/p>\n<p><img decoding=\"async\" src=\"https:\/\/file.ab-sm.com\/103\/uploads\/2022\/12\/c54a52e2b8c2fd88155958ffd3f0ee63.png!a\" alt=\"\" \/><img decoding=\"async\" src=\"https:\/\/file.ab-sm.com\/103\/uploads\/2022\/12\/de8b1664491215c2436c06aef0dd239d.png!a\" alt=\"\" \/><\/p>\n<p>In 2012, jailings announced industry first 2.5, the package with silicone interpreter for their apga product. Another example is per GPU from AMD. In 2015 AMD combined GPU and hpm. Compare with previous solution GPU plus gddr gripping memory. Its size was much smaller with better performance. This is cross section of GPU plus hpm combination. Hpm by itself also have multiple DM dye stacks and tsp inside of DM dye. Sem's image of actual product looks like this. Nbdia also had GPU plus HBM combination in 2016.<\/p>\n<p>2012\u5e74\uff0c\u8d5b\u7075\u601d\u53d1\u5e03\u4e86\u4e1a\u754c\u7b2c\u4e00\u6b3e2.5D \u5c01\u88c5\u7684FPGA \u4ea7\u54c1\u3002\u53e6\u5916\u4e00\u4e2a\u4ea7\u54c1\u662fAMD 2015\u5e74\u53d1\u5e03\u7684GPU\u3002AMD\u8fd9\u6b3eGPU\u7ed3\u5408\u4e86GPU\u548c\u9ad8\u5bbd\u5e26\u5b58\u50a8\u7684HBM \u3002\u4e0e\u4ee5\u524d\u7684\u89e3\u51b3\u65b9\u6848\u76f8\u6bd4\uff0c\u8fd9\u6b3eGPU\u5c3a\u5bf8\u66f4\u5c0f\uff0c\u6027\u80fd\u66f4\u597d\u3002\u8fd9\u662fGPU\u52a0HBM\u7684\u6a2a\u622a\u9762\u793a\u610f\u56fe\u3002HBM\u672c\u8eab\u4e5f\u6709\u591a\u4e2a\u82af\u7c92\u5806\u53e0\u3002\u5b9e\u9645\u4ea7\u54c1\u7684SEM\u56fe\u770b\u8d77\u6765\u50cf\u8fd9\u6837\u3002\u82f1\u4f1f\u8fbe\u57282016\u90a3\u5e74\u4e5f\u6709\u7c7b\u4f3c\u7684GPU\u52a0HBM\u7684\u7ec4\u5408\u4ea7\u54c1\u3002<\/p>\n<p><img decoding=\"async\" src=\"https:\/\/file.ab-sm.com\/103\/uploads\/2022\/12\/7b0cb3e2f7457c0e7c2883e1d9121936.png!a\" alt=\"\" \/><img decoding=\"async\" src=\"https:\/\/file.ab-sm.com\/103\/uploads\/2022\/12\/b9399cf1ab0f33a63197b7e76cd05f48.png!a\" alt=\"\" \/><\/p>\n<p>Stiepener at peripuri is to minimize package warpiece. Another example is broadcom network switch in 2018. It integrated network switch die and hpm memory on silicon interposa. Typically silicone interpreter is made by a foundry and major players are tsmc, umc, global founders, etc. In 2020 tsmc announced their latest 2.5. This solution with huge silicone temperature. It has 2 processor dies at the center and 8 hpm modules around. It uses 2000500mm\u00b2 size silicone interpreter and tsmc plan to start mass production from 2023 this is a brief introduction to 2.5 deep package technology with silicone interposa I hope this can help you to understand basic two point five the package technology have a nice day and see you again soon bye bye.<\/p>\n<p>Stiffener \u662f\u5916\u9762\u7684\u52a0\u5f3a\u6846\u67b6\uff0c\u4e3b\u8981\u662f\u6765\u51cf\u5c11\u57fa\u677f\u7fd8\u66f2\u53d8\u5f62\u3002\u53e6\u4e00\u4e2a\u4f8b\u5b50\u662f2018\u5e74Broadcom\u7684\u4ea7\u54c1\u3002\u5b83\u5c06\u7f51\u7edc\u4ea4\u6362\u673a\u82af\u7c92\u548cHBM\u5b58\u50a8\u5668\u82af\u7c92\u901a\u8fc7interposer\u96c6\u6210\u5728\u57fa\u677f\u4e0a\u3002\u901a\u5e382.5D\u5c01\u88c5\u7531\u4ee3\u5de5\u5382\u5236\u9020\uff0c\u5f53\u524d\u7684\u4e3b\u8981\u53c2\u4e0e\u8005\u6709\u53f0\u79ef\u7535\u3001\u8054\u7535\u3001\u683c\u82af\u7b49\u30022020\u5e74\u53f0\u79ef\u7535\u5ba3\u5e03\u4e86\u4ed6\u4eec\u6700\u65b0\u76842.5D\u5c01\u88c5\u3002\u8fd9\u79cd\u4ea7\u54c1\u5177\u67092\u4e2a\u5904\u7406\u5668\u82af\u7c92\uff0c\u5468\u56f4\u67098\u4e2aHBM\u82af\u7c92\u3002\u5b83\u4f7f\u7528\u7684interposer \u67092500mm\u00b2\u3002\u5e0c\u671b\u8fd9\u4e2a\u89c6\u9891\u53ef\u4ee5\u5e2e\u52a9\u4f60\u4e86\u89e32.5D\u5c01\u88c5\u6280\u672f\uff0c\u518d\u89c1\u3002<\/p>\n<p style=\"text-align: center;\"><img decoding=\"async\" src=\"https:\/\/file.ab-sm.com\/103\/uploads\/2022\/12\/d1fc7e744619a65f99876f7fa06a6b2e.png!a\" alt=\"\" \/><span style=\"color: red;\"><br \/>\n<\/span><\/p>\n<p style=\"text-align: center;\"><span style=\"color: red;\">\u626b\u63cf\u4e8c\u7ef4\u7801\uff0c\u89c2\u770b\u89c6\u9891<br \/>\n<\/span><\/p>\n","raw":"","protected":false},"excerpt":{"rendered":"<p>2.5D\u5148\u8fdb\u5c01\u88c5\u4ecb\u7ecd\uff08\u89c6\u9891\uff09 Hello everyone, welcome to Samsung. 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