【邀請函】2025年第四屆功率半導體產業論壇（2025年6月 華東）

Semiconductor power devices, also known as power electronic devices, are semiconductor devices centered on electric energy conversion. They regulate current and voltage to enable the transformation and distribution of electric energy within systems, delivering adjusted electric power to corresponding end-users and providing fundamental support for system operations.

Translation: Diagram of the Semiconductor Power Devices Industry Chain, sourced from the Shangyang Tong prospectus.

Translation: The upstream of the semiconductor power device industry chain mainly involves the supply of raw materials and equipment, including the supply of wafers, lithography machines, lead frames, wide bandgap materials, and other auxiliary materials. The midstream mainly consists of the research and development, design, manufacturing, and packaging and testing of semiconductor power devices. The downstream application markets cover different fields, including new energy charging piles, photovoltaic energy storage, rail transportation, new energy vehicles, data centers, servers and communication power supplies, industrial control automation, and consumer electronics.

Translation: Diagram of Semiconductor Device Applications, sourced from Infineon.

Translation: Although different application fields and scenarios have varying performance requirements for semiconductor power devices, all are evolving towards higher power density, miniaturization, higher efficiency, lower energy consumption, and higher reliability. In order to meet the differentiated application needs of power semiconductor devices, it is often necessary to continuously optimize device performance through new materials, new structures, new packaging, and intelligence, among other key technologies.

▲Si、SiC、GaN性能比較，圖源網絡

自20世紀50年代以來，硅（Si）一直是半導體的主要材料。目前，硅器件的發展已經十分成熟，Si基IGBT器件憑借其優異的性能得到了廣泛應用，在過去的30年內不斷地更新換代，不斷有新的器件結構被提出，目前主流產品可分為7代。盡管如此，受限于硅材料特性的限制，硅器件的發展空間已經較為有限。近年來，碳化硅（SiC）、氮化鎵（GaN）等寬禁帶半導體材料快速發展，在部分應用場合替代Si材料，例如碳化硅功率器件加速“上車”，越來越多的新能源新車型導入了碳化硅技術，搭載碳化硅的新車型密集發布；同時在手機快充領域風生水起的氮化鎵在車用場景的應用持續取得進展，被用于座艙內快充、車載激光雷達等，未來有望應用在新能源汽車車載充電器、DC/DC轉換器、牽引驅動或電機控制等領域。

（往屆精彩瞬間視頻）

Translation: As the application fields of power semiconductor devices continue to expand, the performance requirements for these devices are also becoming increasingly demanding. Therefore, the development of new packaging technologies is necessary to enhance the performance of power semiconductor devices. These include innovations in copper (or aluminum) ceramic substrates, heat dissipation substrates, encapsulation materials, and casing materials, as well as key technologies such as ultrasonic bonding, large-area silver sintering, and copper interconnects.

艾邦將于2025年6月在華東舉辦第四屆功率半導體產業論壇，本論壇旨在匯聚功率半導體器件（Si/SiC/GaN）行業的專家、學者和企業代表，深入探討功率半導體器件的發展現狀、技術挑戰以及未來趨勢。通過交流與合作，推動行業技術創新，促進半導體功率器件在各個應用領域的廣泛應用。